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Huawei productdetail mob

Kirin 990 5G

Cutting-edge 7 nm+ EUV process builds the world's first full-frequency 5G SoC with peak downlink rates. Another first – its HUAWEI Da Vinci Architecture NPU with all new tiny-core that marries intelligent computing power with ultra-low power consumption. Its CPU and GPU deliver a fast and smooth user experience. The camera is enhanced even in low light thanks to block-matching and 3D filtering (BM3D) and dual-domain video noise reduction. This enhanced Kirin 990 gives you a 4G mobile experience with upgraded performance, energy efficiency, AI, and photography.
  • feature1

    World's first flagship 5G SoC

  • feature2

    7 nm+ EUV process

  • feature3

    HUAWEI Da Vinci Architecture (dual-core NPU with tiny-core NPU)

Key Features

Process

• 7 nm+ EUV
CPU

• 2x Cortex-A76@2.86 GHz
• 2x Cortex-A76@2.36 GHz
• 4x Cortex-A55@1.95 GHz
GPU

• 16-core Mali-G76
AI

• HUAWEI Da Vinci Architecture,
• 2x Ascend Lite + 1x Ascend Tiny
• HiAI 2.0
Modem

• 2G/3G/4G/5G
• SA & NSA fusion network architecture
• FDD & TDD spectrum access
ISP

• Kirin ISP 5.0
• BM3D DSLR-level image noise reduction, dual-domain video noise reduction
Memory

• LPDDR4X

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Technical Support
HiSilicon Official Site
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Kirin Chipsets
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Kirin 990 5G Chipset

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