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Huawei productdetail mob

Kirin 820

This SoC works with both SA/NSA and TDD/FDD full-frequency bands for reliable and stable 5G connections. Its HUAWEI-designed Da Vinci NPU lets Kirin 820 offer 73% more AI computing power with less power consumption. Thanks to its multi-core CPU, this generation's performance is improved by 27%. The Mali-G57 GPU, backed by Kirin Gaming+ 2.0 technology, boosts performance by 38% and energy efficiency by 39% for uninterrupted gaming. Photography enthusiasts can take advantage of HUAWEI-developed ISP 5.0 for clearer night-time photos.
  • feature1

    5G SoC for the best 5G experience

  • feature2

    HUAWEI Da Vinci NPU architecture

  • feature3

    1+3+4 robust and energy efficient CPU architecture, Mali-G57 GPU

Key Features

Process

• 7 nm
CPU

• 1x Cortex-A76@2.36 GHz
• 3x Cortex-A76@2.22 GHz
• 4x Cortex-A55@1.84 GHz
GPU

• 6-core Mali-G57, Kirin Gaming+ 2.0
AI

• HUAWEI Da Vinci Architecture, Ascend D110 Lite
• HiAI 2.0
Modem

• 2G/3G/4G/5G
• SA&NSA fusion network architecture
• FDD&TDD spectrum access, DSDS3.x
ISP

• Kirin ISP 5.0
• BM3D DSLR-level image noise reduction, dual-domain video noise reduction
Memory

• LPDDR4X
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Technical Support
HiSilicon Official Site
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Kirin Chipsets
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Kirin 820 Chipset

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