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Huawei productdetail mob

Kirin 810

An NPU with HUAWEI Da Vinci Architecture enables Kirin 810 to be energy-efficient for any AI application. The state-of-the-art 7 nm chipset is 20% more efficient and 50% more transistor-dense than an 8 nm chipset. The CPU (system-level AI frequency modulation scheduling and innovative 2+6 core architecture) and GPU (custom Mali-G52 with Kirin Gaming+ experience) equip the Kirin 810 for photographic, communications, and AI applications.
  • feature1

    Camera ISP performance and algorithms, NR, detail enhancement

  • feature2

    Dual SIM dual VoLTE high-speed mobile communications

  • feature3

    HUAWEI HiAI compatibility

Key Features

Process

• 7 nm
CPU

• 2x Cortex-A76@2.27 GHz + 6x Cortex-A55@1.88 GHz
GPU

• Mali-G52
AI

• HUAWEI Da Vinci Architecture
• Ascend D100 Lite
Modem

• LTE Cat 12/13 UL
ISP

• Kirin ISP4.0
Memory

• LPDDR4X@2133 MHz
Voice

• Dual SIM dual VoLTE
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Technical Support
HiSilicon Official Site
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Kirin Chipsets
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Kirin 810 Chipset

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